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| Semiconductor Equipment Department |
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CSP/ BGA Ball Mounting System
Model: BM-600S |
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| Features: |
| (1) |
Wide Range of Substrate Size:
CSP/BGA Size to Large Substrate: 440x260mm |
| (2) |
Ø70µm Ball Size in 150µm Ball Pitch |
| (3) |
Multi-Heads enable high quality mounting |
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| Basic Specifications |
| Model |
BM-600S |
| Substrate Size |
Max. 440mm x 260mm |
| Ball Diameter |
Ø70µm - Ø300µm |
| Min. Ball Pitch |
150µm |
| System Dimensions |
2380mm (W) x 1730mm (D) x 1650mm (H) |
| System Weight |
Approx. 1900kg |
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Distributed by
Silicon Valley Branch
1615 Wyatt Drive, Santa Clara, CA 95054 United States
Tel: (408) 501-1470/     (408) 501-1471
E-Mail: salesurs7@kanematsuusa.com
Company Website: www.kanematsuusa.com
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| ©2009 Kanematsu USA Inc. - all rights reserved |
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