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| Semiconductor Equipment Department |
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CSP/ BGA Ball Mounting System
Model: BA-1500PP |
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| Features: |
| (1) |
The Screen Printing Method with Automatic Positioning Adjustment using Image Recognition.
A Mask Cleaning Unit included as standard. |
| (2) |
Min. Ball Diameter 0.2mm in 0.4mm Ball Pitch |
| (3) |
Cleaning Units for Flux Printing Stencil and Transfer Pins |
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| Basic Specifications |
| Model |
BA-1500PP |
| Substrate Size |
27-85mm (W) x 150-270mm (L) |
| Ball Diameter |
Ø0.2mm - Ø1.0mm |
| Min. Ball Pitch |
0.4mm |
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Distributed by
Silicon Valley Branch
1615 Wyatt Drive, Santa Clara, CA 95054 United States
Tel: (408) 501-1470/ (408) 501-1471
E-Mail: salesurs7@kanematsuusa.com
Company Website: www.kanematsuusa.com |
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| ©2009 Kanematsu USA Inc. - all rights reserved |
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