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Semiconductor Equipment Department

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  6", 8" & 12" Wafer Prober
Model: OPUSII
Features: 
(1) 6", 8" & 12" Wafers without Mechanical Changeover
(2) Flat Top for Large Test Head
(compatible with SEMI Standards)
(3) Fast Linear Motor Control for XY Stage
(4) Z-Down Control at the Time of Power-Down
(5) 200x100 Needle Cleaner
(6) CCD Camera Cassette Mapping for Thin Wafers
(7) One-Touch Card Changer
(8) High-Performance OCR
(9) SECS GEM Compliance
(10) Short Index Time 
E-mail: salesurs7@kanematsuusa.com
or Call: (408) 501-1470 or (408) 501-1471
Inquiry   
Basic Specifications
Model  OPUSII
Wafer Size/ Thickness 6", 8" & 12" Wafers/ 180µm - 2000µm
Accuracy Positioning Accuracy: }1.5µm (X/Y), }3µm (Z)
Contact Accuracy: }3µm (X/Y), }5µm (Z)
 
Card Holder Unit Flatness Max. 20µm, Ø300mm
Temperature Range Ambient - +150ºC (Option: -40ºC/ -10ºC)
Chuck Force 200kg
Index Time 200 msec. (5mm x 5mm x 0.5mm)
Dimensions 1460mm (W) x 1350mm (D) x 960mm (H)
Weight 1500kg

Available Versions


OPUSII-S OPUSII-M

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Distributed by

Silicon Valley Branch

1615 Wyatt Drive, Santa Clara, CA 95054 United States
Tel: (408) 501-1470/ (408) 501-1471
E-Mail: salesurs7@kanematsuusa.com
Company Website: www.kanematsuusa.com
 
©2009 Kanematsu USA Inc. - all rights reserved
 SEMICS Wafer Prober OPUSII OPUS2
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