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Semiconductor Equipment Department

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  6", 8" & 12" Wafer Prober
Model: OPUS3
Features: 
(1) Smart Probe card Alignment (SPA) Mechanism
(2) Intelligent Overdrive Control
(3) 6", 8" & 12" Wafers without Mechanical Changeover 
(4) Superior Tri-Temp. Control (Cold/ Ambient/ Hot)
(5) Flat Top for Large Test Head
(6) Easy On-Site Calibration
(7) Fast Index/ Less Vibration
(8) Fastest & Simplest Auto Card Changer
(9) Fast Linear Motor Control for XY Stage
(10) Z-Down Control at the Time of Power-Down
(11) 200x100 Needle Cleaner
(12) CCD Camera Cassette Mapping for Thin Wafers
(13) High-Performance OCR
(14) SECS GEM Compliance
E-mail: salesurs7@kanematsuusa.com
or Call:(408) 501-1470 /(408) 501-1471
Inquiry 
 
New Feature!
SPA (Smart Probe card Alignment)
Monitoring the contact pressure of probe pins, wafer chuck
automatically automatically align itself to probe card
.
 
Basic Specifications
Model  OPUS3
Wafer Size 6", 8" & 12" Wafers   
Accuracy ±1.5µm 
Card Changer 350mm - 480mm 
Temperature Range -55 - +200ºC (with Ambient Control)
Chuck Force 300kg
Index Time 200 msec. (5mm x 5mm x 0.5mm)

Auto Cassette Loader may be ordered in 3 different ways:
(1) Flat Top Loader
(2) Top Loader
(3) Dual Foup Loader

OPUS3 with Top Loader OPUS3 Dual Foup Loader

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Distributed by

Silicon Valley Branch

1615 Wyatt Drive, Santa Clara, CA 95054 United States
Tel: (408) 501-1470/ (408) 501-1471
E-Mail: salesurs7@kanematsuusa.com
Company Website: www.kanematsuusa.com
 
©2009 Kanematsu USA Inc. - all rights reserved
 SEMICS wafer prober OPUS3 OPUSIII
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