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Semiconductor Equipment Department

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  High-Speed IC Test Handler
Model: TR60
 
Features: 
(1) Tri-Temp. Capability (-60 - +140Cº)
(2) Stable Pick & Place of Small Devices (Min. 3x3mm)
(3) Loadboard Compatible with NS-series
(Note: There are some exceptions)
(4) Max. Throughput: 4000UPH
(5) Vertical Docking
E-mail: salesurs7@kanematsuusa.com
or Call: (408) 501-1470 or (408) 501-1471
Inquiry   
Basic Specifications
Model TR60
Device Type/ Size QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3x3mm - Max. 32x32mm (Lead Pitch: 0.4mm or more)    
Test Mode Square Quad (2x2)
Inline Quad (1x4)
Dual/ Single
 
Standard Socket Pitch Square Quad: 80mm (X) x 60mm (Y)
Inline Quad: 40mm (X)
Dual: 80mm (X)
 
Min. Index Time 0.65 sec.
Max. Throughput 4000UPH (Quad)
Temperature -40ºC - +140ºC }3ºC (Standard)
-60ºC - -40ºC }5ºC (Optional)
Standard Tray Size JEDEC Trays (135.9 x 315.0mm) 
Binning 6 Hardware Binning (3 Auto/ 3 Manual)
15 Software Binning
Power Triple-Phase AC200-240V 50/60Hz 10kVA   
Dimensions 1570(W) x 1270(D) x 1880(H) mm 
Weight Approx. 1200kg 

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Distributed by

Silicon Valley Branch

1615 Wyatt Drive, Santa Clara, CA 95054 United States
Tel: (408) 501-1470/ (408) 501-1471
E-Mail: salesurs7@kanematsuusa.com
Company Website: www.kanematsuusa.com
 
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